LinkedIn Group Preps Server Specs

From www.eetimes.com 4 years ago in News

LinkedIn has partnered with Hewlett-Packard Enterprise, GE Digital, and others to form Open19, a group working on server specs for data centers.

Articles from EETimes

AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC

From www.eetimes.com 5 days ago in News

The common theme coming out of the chiplet forum at ISSCC was the need for a 3D interconnect density roadmap. The post AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC appeared first on EETimes.

UK Consumer Watchdog on Qualcomm’s Tail

From www.eetimes.com 5 days ago in News

The allegation is that Qualcomm has been overcharging Samsung and Apple since 2015, with the charges passed on to consumers. The post UK Consumer Watchdog on Qualcomm’s Tail appeared first on EETimes.

Congress Creates a Focal Point for Optics, Photonics

From www.eetimes.com 5 days ago in News

Light-based technologies come into focus as part of a larger U.S. technology innovation push. The post Congress Creates a Focal Point for Optics, Photonics appeared first on EETimes.

IBM Brings 8-Bit AI Training to Hardware

From www.eetimes.com 5 days ago in News

State-of-the-art low precision algorithmic work now embodied in 4-core AI accelerator chip, enabling efficient 8-bit training and 4-bit inference The post IBM Brings 8-Bit AI Training to Hardware appeared first on EETimes.

Connected Cars: Show Me The Money

From www.eetimes.com 5 days ago in News

Agreeing that "data is the new oil," companies like Otonomo are positioning themselves to monetize the data from connected cars. The post Connected Cars: Show Me The Money appeared first on EETimes.

Chip Sales Remain Strong in Challenging Year

From www.eetimes.com 5 days ago in News

Chip sales remain strong in challenging year, but SIA believes that federal manufacturing and research investments present a crucial opportunity. The post Chip Sales Remain Strong in Challenging Year appeared first on EETimes.

Allowing Machines to Listen, and Understand

From www.eetimes.com 6 days ago in News

The dynamic audio sensor allows machines to listen, and understand, at low power. It could be useful in the voice-activated devices on our desks, in our pockets, and distributed around our homes. The post Allowing Machines to Listen, and Understand...

Verizon Commits $45.5B for 5G Mid-Band Spectrum

From www.eetimes.com 6 days ago in News

Verizon and AT&T, desperate for more robust 5G spectrum, together accounted for 85% of the $81B spent in the mid-band auction. The post Verizon Commits $45.5B for 5G Mid-Band Spectrum appeared first on EETimes.

Executive Order Paves Way for $37bn to Boost U.S. Chip Capacity

From www.eetimes.com 6 days ago in News

US President's executive order expects to add $37 billion investment to address short-term chip capacity shortfall. The post Executive Order Paves Way for $37bn to Boost U.S. Chip Capacity appeared first on EETimes.

New Rohm Fab Will Add Capacity for SiC Devices

From www.eetimes.com 6 days ago in News

The facility should help refill the pipeline for silicon carbide devices used in high-power applications, such as electric vehicles. The post New Rohm Fab Will Add Capacity for SiC Devices appeared first on EETimes.