Electronics, DIY, Makers, Hackers and Internet of Things (IoT)
6 years ago in News
2 days ago in News
There will be strong demand for ICs for the next few years, and TSMC is responding by increasing spending on more capacity, mostly in Taiwan. The post TSMC Boosts Capital Budget Again, to $30B appeared first on EETimes.
3 days ago in News
DSP Concepts is announcing support for the Cadence Tensilica HiFi 5 DSP in their Audio Weaver platform with a general release planned for the end of Q2 2021. The post DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi...
Chip industry executives met with President Biden, exposing the challenge of where to focus the President's proposed $50 billion support package. The post Spending $50B on the Chip Industry is a Challenge appeared first on EETimes.
Allwinner Technology today announced the launch of 「D1」 processor, which is the world’s first mass-produced application processor equipped with T-Head Xuantie 906 based on RISC-V, providing an exciting new smart chipset for immediate use in today’s developing Artificial Intelligence of...
4 days ago in News
Sizeable Series C funding for Groq nonetheless dwarfed by competitors’ raises in this space The post Groq Closes $300 Million Funding Round appeared first on EETimes.
Mavenir and Xilinx have stolen a march on rivals with an end-to-end massive MIMO portfolio for 4G and 5G networks based on the emerging RAN technology specifications. The post Mavenir, Xilinx First with Open RAN Support for Massive MIMO appeared...
Roku OS 10, introduced this week, includes several handy improvements, including a button-activated voice search function. The post Roku Introduces OS 10 appeared first on EETimes.
A robotic repair service extends the life of an active satellite, promising a new era of reusable spacecraft. The post Operational Satellite Gets an Extended Warranty appeared first on EETimes.
5 days ago in News
Kuprion’s Copper Filled Thermal Vias address the increased reliability demands of heat and power dissipation for complex, advanced high-performance systems. The post Kuprion’s Copper Filled Thermal Vias for High Power Dissipation appeared first on EETimes.
California AI hardware startup SambaNova raises further $676m funding, now valued at $5bn+ The post SambaNova Raises Eye-Popping Series D Funding appeared first on EETimes.