With no definitive release date for DDR5, DDR4 is making significant strides.

Behind the explosion in computer vision is tremendous growth in the world of 3D imaging. What’s the state of 3D imaging today and where are we headed?

The new PSPICE for TI enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.

The printed solar cells are so light, thin, and flexible that they can rest on a bubble.

Scientists at the Gwangju Institute of Science and Technology (GIST) in Korea have developed a new technology that visualizes the invisible.

This article dives into how Fusion 360 can be used to produce smarter microelectronics.

This article explains a statistical measure that helps us to draw conclusions about how one variable affects another.

Molded interconnect devices, when conditioned with laser direct imaging, could be a helpful 3D supplement to PCB design.

Researchers have found that just a touch of gold can change the structure of a crystal and effectively turn it into a semiconductor.

With IoT on the rise, engineers are increasingly faced with options of transformer topologies in Power-over-Ethernet (PoE)-based designs.

Researchers at Imec and Ghent University have embedded microelectronics into a biocompatible "smart contact lens" to remedy a host of vision problems, from keratoconus to general light sensitivity.

In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs. 

What are the implications of NVIDIA both competing in the Arm market and now, owning Arm itself?

A new long-range specification is here, and it's got a few contending features compared to Amazon Sidewalk and Zigbee.

Photorelays are gaining traction. In many cases, these devices outpace their mechanical counterparts in terms of size and power efficiency.

Micro-LEDs open doors for display technology to be twisted and folded—all while providing higher resolutions than existing LCDs or OLEDs.

Samsung, Hewlett Packard, Intel, and SK Telecom have recently announced their partnership to develop an NFV platform aimed at democratizing 5G.

Australian researchers claim their e-skin prototype can react to pain, similarly to human skin. If developed, this could lead to major leaps in robotics and medical prosthetics.

This week, Renesas has released their newest product: a data buffer for DDR5 aimed at empowering a new generation of high-performance computing applications.

Scientists in Singapore have developed an AI system that recognizes hand gestures by combining wearable skin-like sensors with computer vision.

Leveraging their A2B audio bus technology, Analog Devices has released a full audio system for fast prototyping, evaluation projects, demonstrations, and educational applications.

In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.

The new Arm Cortex-R82 looks to address the imminent challenges of mass data creation and processing needs.

Engineers say they’re creating a low-power collision detector that mimics the way locusts avoid one another when flying in swarms.